| About Microdul: |
| Microdul develops
and produce customized microelectronic
components, since 1970. As an engineering based
company, it provide system solutions in
microelectronic form.
Microdul have a long lasting experience in ASIC-design and
customized packaging. It provides
Micro-electronic solutions for your system
requirements.
Microdul is
your partner for customized microelectronics. |
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| Microdul and
ni2designs: |
| Microdul has
appointed ni2designs as their channel partner
for Indian region. ni2designs would
provide an easy path to access fabrication and
design services of Microdul.
ni2designs would help its customers to boost
their design cycles with package of CATENA
LAYTOOLS and MD300/MD500 arrays, which would be
fastest package to design your own Mix-Signal
ICs.
At the same point of time, ni2designs would also
provide support to Microdul customers for its MD
family of arrays.
Being as channel partners ni2designs will also
promote design services offered by Microdul in
the field of Mix-signal design, power
electronics, RF circuits, and low power designs. |
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| Electronic Modules: |
| Microdul develop intelligent and
efficient solutions for your applications. We
are expert in building compact, customized
modules. Our simulation and design tools allow
us to solve even the most demanding problems.
Thanks to our diverse equipment we are able to
chose the optimal technologies for your modules
and offer you a cost efficient solution. We
normally procure all the needed components and
materials for your product. Before delivery, all
circuits are tested according to your
specifications. This enables us to offer you a
zero defect guarantee for the delivered
products. |
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| Services offered by
Microdul: |
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Fabrications & Production facilities. |
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Purchase and logistics of materials and
components. |
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100% testing of all products according to your
specifications. |
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Zero defect guarantee for the delivered
products. |
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Lifetime and quality tests. |
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| ASIC Technologies: |
| We are
experienced specialists in the design of mixed
signal circuits on a semicustom-basis. If your
application involves the acquisition,
conditioning and processing of various analog
signals we work together with you to find an
efficient, intelligent solution. From your
product idea, through the development of a
circuit concept and the chip design to the
delivery of fully tested and quality-guaranteed
production quantities we deliver you a
successful product. Contrary to what has become
standard in the development of purely digital
circuits using standard cells, the development
of analog circuits requires the special know-how
of experts. We have that team. Thanks to our
semicustom design philosophy, we are
cost-effective and fast during the development
phase. |
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| MD Family - CMOS Semicustom Arrays
for Mixed Signal Circuits: |
| A semicustom
circuit consists of many prefabricated active
switching elements usually arranged in regular
arrays on a base chip. To create a desired
functionality, the interconnection between these
elements is customized, typically using one or
two additional metallization levels. For example
mixed signal (analog/digital) circuits are
notoriously difficult to realize with the common
semicustom families (CMOS gate arrays for
digital and bipolar arrays for analog circuits).
Microdul's semicustom arrays have been designed
with exactly this market segment in mind. They
are manufactured using mature SACMOS
technologies. Besides conventional gate array
structures they also feature many elements
necessary for analog circuit design: different
resistors, capacitors, diodes and transistors
with special geometries. These arrays allow the
development of circuits with digital as well as
complex analog functions. As you can see from
our examples our semicustom arrays can be
optimized for many different applications.
Wafer service
If you would like to do your own design using
our arrays, you can go for our MPW services. You
will receive 40 samples packed in a ceramic
package typically within 6 weeks of tape-out
date. |
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| The Arrays: |
| MD300 |
The MD300 semicustom array is
manufactured in a 1µm n-well silicon gate SACMOS
process. It contains about 1200 logic gates, 32
EPROM cells, 800 optimized analogue transistors,
resistors and capacitors within an area of 1.7mm².
All 16 connecting pads have input/output capability
and ESD protection components. A particular
application can be configured using 3 masks, two
metal and one via mask.
The MD300 is specially suited for ultra low
power consumption applications. Typical examples for
low power circuits can be Quartz watch, RTC,
sensors, etc.
Multiproject wafers are started regularly in order
to allow cost effective prototyping.For more
information on MD300 array
click here. |
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| MD500 |
The MD500 semicustom array is based on
a 0.9µm n-well silicon gate SACMOS process. There
are around 5500 logic gates, 2300 transistors optimised for analogue circuitry, 64 EPROM cells as
well as resistors and capacitors avaible on a 4.4mm²
chip area. All of the 32 connecting pads have
input/output capability and ESD protection
components. A particular application can be
implemented using two metal masks and two via masks.
The MD500 is specially suited for ultra low power
consumption applications. Typical examples for low
power circuits can be Quartz watch, RTC, sensors,
etc.
Multiproject wafers are started regularly in order
to allow cost effective prototypingFor more
information on MD500 array
click here. |
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| Bonding: |
| Die and Wire-bonding belong to
our key technologies. We glue or solder dies
onto the substrates. They are then wire-bonded
protected with a glob-top. We manufacture chip
on board as well as chip on chip and chip on
ceramic. All common materials and wire
thicknesses are used in wire bonding. Our
capabilities include Al-wedge-wedge bonds,
Au-ball bonds as well as Pt-wedge-wedge bonds
for high temperature applications. Our core
competences are: |
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- Chip on Chip or Die on Die
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Ceramic |
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Board |
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Solder, pick and place |
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SMD |
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BGA |
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Flip-Chip |
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Al wedge-wedge bonds |
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17µm to 480µm |
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Au-ball-bonds, fine wire |
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Pt wedge-wedge-bonds |
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| Testing &
Verification Facilities at Microdul: |
Every module manufactured by
MICRODUL is measured and tested according to
customer specifications. Our test department is
very experienced in measuring and testing
customized electronic circuits. Our modular
equipment allows us to measure new circuits fast
and accurately. We can accurately measure from 0
to 2 GHz, from 1pA up to several 100 A and from
<1µV to 2kV. All measurements are properly
documented and test results can be supplied to
the customer. Our strengths include:
High accuracy and fast measurements due to
flexible modular equipment:
1pA up to >100A
<1µV up to 2kV
0 HZ up to 2GHz
Experienced test team
100% documentation according to customer
requirements and ISO 9001 / ISO 13485 |
Contact:
Microdul AG
Grubenstr. 9
P.O. Box
CH - 8045 Zürich
Tel: +41 44 455 35 12
Fax: +41 44 455 35 95
www.microdul.com
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